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NTLUS3192PZ
Advance Information
Power MOSFET
? 20 V, ? 4.2 A, m Cool t Single P ? Channel,
ESD, 1.6x1.6x0.55 mm UDFN Package
Features
? UDFN Package with Exposed Drain Pads for Excellent Thermal
Conduction
? Low Profile UDFN 1.6 x 1.6 x 0.55 mm for Board Space Saving
? Lowest RDS(on) in 1.6x1.6 Package
? ESD Protected
? This is a Halide Free Device
? This is a Pb ? Free Device
Applications
? High Side Load Switch
? PA Switch and Battery Switch
? Optimized for Power Management Applications for Portable
Products, such as Cell Phones, PMP, DSC, GPS, and others
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
? 20 V
http://onsemi.com
MOSFET
R DS(on) MAX
85 m W @ ? 4.5 V
115 m W @ ? 2.5 V
160 m W @ ? 1.8 V
250 m W @ ? 1.5 V
S
G
I D MAX
? 3.0 A
? 1.5 A
? 0.5 A
? 0.2 A
Parameter
Drain-to-Source Voltage
Symbol
V DSS
Value
? 20
Units
V
Gate-to-Source Voltage
V GS
± 8.0
V
D
1
m COOL t
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Continuous Drain
Current (Note 2)
Steady
State
t ≤ 5s
Steady
State
t ≤ 5s
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
I D
P D
I D
? 3.4
? 2.4
? 4.2
1.5
2.3
? 2.2
? 1.6
A
W
A
1
6
P ? Channel MOSFET
MARKING
DIAGRAM
UDFN6
CASE 517AU AA M G
G
AA = Specific Device Code
M = Date Code
G = Pb ? Free Package
Power Dissipation (Note 2)
Pulsed Drain Current
T A = 25 ° C
tp = 10 m s
P D
I DM
0.6
? 17
W
A
(Note: Microdot may be in either location)
Operating Junction and Storage
Temperature
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
Gate-to-Source ESD Rating
(HBM) per JESD22 ? A114F
T J ,
T STG
I S
T L
ESD
-55 to
150
? 1.0
260
1000
° C
A
° C
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface-mounted on FR4 board using the minimum recommended pad size
of 30 mm 2 , 2 oz. Cu.
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2009
May, 2009 ? Rev. P3
1
Publication Order Number:
NTLUS3192PZ/D
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